Intel said it has made a significant breakthrough in the development of glass substrates for next-generation advanced packaging.
said that he was one of just two journalists to get the first look at how Intel’s glass substrate works. He said, “The A17 Pro processor in Apple's iPhone 15 Pro has 19 billion transistors. Intel's Ponte Vecchio supercomputing processor has more than 100 billion. By the end of the decade, Intel expects processors with -- if you can imagine it -- a trillion transistors.”
“Glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus for lithography, and have the dimensional stability needed for extremely tight layer-to-layer interconnect overlay,” said Intel in a“As a result of these distinctive properties, a 10x increase in interconnect density is possible on glass substrates.
“Scaling is crucial to the progress and evolution of the semiconductor industry, and glass substrates are a viable and essential next step for the next generation of semiconductors,” said the press release.Ultra-low flatness.
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